Copper

Thermodynamic properties


ΔfH°gas (kJ/mol): 337.4 (monoatomic) [6]
484.2 (Cu2) [6]
ΔfH°solid (kJ/mol): 0.0 (monoatomic) [6]
ΔfH°fusion (kJ/mol): 13.26 [6]
ΔfH°vaporization (kJ/mol): 307±6 [2]
S°gas (J/mol·K): 166.4 (monoatomic) [6]
241.6 (Cu2) [6]
S°solid (J/mol·K): 33.2 (monoatomic) [6]
ΔfG°gas (kJ/mol): 297.7 (monoatomic) [6]
431.9 (Cu2) [6]
Cp (gas) (J/mol·K): 20.8 (monoatomic, 25 °C) [6]
36.6 (Cu2, 25 °C) [6]
Cp (solid) (J/mol·K): 24.3364 (20 °C) [3]
24.440 (monoatomic, 25 °C) [6]
24.6024 (100 °C) [3]
25.4801 (200 °C) [3]
26.9961 (500 °C) [3]
29.5229 (1000 °C) [3]
Coeff. of linear thermal expansion (106 K-1): 17.0 (20 °C) [3]
16.5 (monoatomic, 25 °C) [6]
17.1 (100 °C) [3]
17.2 (200 °C) [3]
18.3 (500 °C) [3]
20.3 (1000 °C) [3]